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Toptechpcb is a leadingmanufacturer of solutions that provide high quality quick turn, small and medium-sized volume PCB for domestic and foreign hi-tech enterprises andresearch institutions , mainly provides Single-layer to Multilayer PCB ranged from prototype sample and small medium quantity.

At toptechpcb, we are understandsyour technical challenges. Whether you need quick prototypes, a cost effective solution for your rigid, rigid-flex, mixed dielectrics , we have theexperience, the people and the technology to meet these challenges. We competein time and must go beyond our current boundaries to provide competitive PCB`s and services outside what is considered normal service.

Toptechpcb prides itself inbeing a Total Solutions Provider and manufactures quality rigid, metal-backedand flex printed circuit boards on various types of substrates for a variety ofapplications. These products can go into high speed computing, high frequency telecommunicationranging, defense, LEDs and other heat sink automotive electronics, and navigationdevices – right from small test and prototype quantities to large volumeproduction. We provide all of our technologies in a time critical environment.

At Toptechpcb, quality is a wayof life. The staff is made up of world class, highly experienced Ph.D.materials scientists, engineers, Six Sigma black belts, and several Six Sigmagreen belt candidates undergoing training. Toptechpcb hasstate-of-the-art process control system sand our certifications include ISO9001:2008 and QS2000 series. We have rigorous SPC controls, automated opticalinspection, metallographic cross section and electrical test facilities. Theseprovide the quality assurance needed to meet the high standards of our customers

Production Capabilities

Layers count: 50
Min Line width/spacing(mil): 3.0/3.0
Max Aspect Ratio: 40:1
Board thickness(mil): 0.2mm~8.0mm
Max Panel size: 22.5″* 49″
Material: FR-4,High Tg FR-4,Halogen free,High Frequency
(Rogers,Arlon,Taconic,Nelco...)etc.
Surface Treatment: HASL,ENIG,ENEPIG,Immersion Silver,Immersion Tin,Flash Gold,Golden Finger,OSP,Lead free HASL etc.

Rigid-Flex Board

Mass production capacity for high density rigid-flex board fabrication
Layer Count/flex layer:36/10Min Line width/spacing for inner layer(mil): 3.0/3.0Max Aspect Ratio: 20:1Min Hole size(mil): 6Impedance control:10%

HDI

3+C+3: Mass production

4+C+4:Small volume﹠Mass production

Laser via(Plugging via):Mass production

Min microvia hole size(mil) :4

Metal substrate board

Layers count:Metal substrate: 1-12L

Embedded metal/Heat sink/Sweat bonding: 2-24L

Ceramic substrate: 1-2L

Board thickness :0.5-7.0mm

Size:max:610*610 mm ,min:5*5mm

Mechanic: X/Y/Z tolerance±0.03mm, speaker hole, screw hole

Thermal conductivity: Standard materials: 1-4W/m.k,

Specified materials : 5-12W/m.k

Ceramic materials: 24-170W/m.k

Max copper thickness:28OZ

Metal partial surface treatment: Anodic oxidation, Hard anodic oxidation coating, Chemical passivation, Sandblasting, Wire drawing, Al electroplating

Surface treatment: Leaded HASL/Lead free HASL, OSP, ENIG, ENEPIG, Plating(Ni)Soft/Hard gold, Immersion Sn, immersion silver, Organic Coating

Type: Pre-bonding, Postbonding, Sweat bonding, Metal substrate, Embedded metal, Heatsink,Ceramic substrate